Complexe communicatie tussen chip en buitenwereld

Micro system technology MEMS/NEMS Precision-technology
Mikroniek 1-2000 by S. Bootsma 27 April 2006

Met de toenemende miniaturisatie neemt de complexiteit van de communicatie tussen chip en de buitenwereld momenteel ingewikkelde vormen aan. In dit artikel wordt een overzicht geschetst van het terrein waarop de werkgroep Microverbinden van de NVPT zich wil richten.


References

Order of frictions and stiffnesses…

For lumped systems consisting of different frictions and stiffnesses, there has been confusion in literature about hysteresis curves and virtual play for many decades.

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Make it clean

In mid-April, the second edition of the Manufacturing Technology Conference and the fifth edition of the Clean Event were held together, for the first time, at the Koningshof in Veldhoven (NL).

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Bringing particles to light

Particle contamination monitoring and cleanliness control are fundamental to micromanufacturing processes across diverse industries to achieve cost-effective production of high-quality and reliable microscale devices and components.

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