QUADRA: metrology for the ongoing evolution of Moore’s law
The semiconductor roadmap is currently fuelled by innovations along three trends
Hybrid bonding for advanced packaging at system level, the transition from FinFET towards GAAFET 3D design technology for faster switching times, and the move towards EUV lithography and high-NA allowing 3 nm and lower nodes in high-volume manufacturing (HVM). Conventional metrology solutions in semiconductor fabs face the daunting task of enabling process control with these trends. Nearfield Instruments’ QUADRA has been proven to provide the necessary metrology solution for these three developments in HVM. This Mikroniek article shows how QUADRA tackles these challenges head-on through a systems engineering approach including measurement mode, probe and image processing development. (Image courtesy of Nearfield Instruments).
