NEWS 27 February 2025
PIC testing on wafer level
Automated testing of photonic integrated circuits (PICs) before packaging is crucial to achieve higher throughput.
The photonic test prober SIRIUS, developed within a MEKOPP consortium project led by IMS, offers an automated solution for optical and electrical testing at wafer level. As described in this Mikroniek article, a demonstrator was set up to validate its functionality for wafer testing, while parallel research focused on simplifying the manipulators for the optical probes and collision avoidance for trench coupling. (Image courtesy of IMS)
