NEWS 23 February 2022

High-NA EUV lithography challenges – the imec perspective

In the course of 2025, the introduction of the first high-NA (numerical aperture) extreme ultraviolet (EUV) lithography equipment in high-volume manufacturing environments is foreseen.


These next-generation lithography systems will be key to advance Moore’s Law towards the logic 2-nm technology generation and beyond. In this Mikroniek article, imec scientists and engineers involved in preparing this major next step in semiconductor lithography (driven by equipment maker ASML) discuss challenges and opportunities. They highlight recent insights and progress obtained in developing the patterning processes, metrology and photomasks needed for enabling the high-NA EUV lithography infrastructure. (Image courtesy of imec)


References

May 30 DSPE Knowledge day…

Please be invited to the upcoming DSPE Knowledge Day at Settels Savenije Eindhoven.

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Lunch lecture May hosted by…

Precision in roll -2- roll electronics

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YPN visited Kulicke & Soffa…

The Young Precision Network (YPN) - part of the DSPE community - organises events for young professionals and students. On Thursday February 1st, YPN organised a visit to Kulicke & Soffa in Eindhoven.

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