Resultaten, Glasvezel-chip koppeling

In de telecommunicatiesector is het gebruik van glasvezel niet meer weg te denken. Maar de prijs van opto-elektronische devices is hoog, omdat de koppeling tussen glasvezel en de optische uitgangen van de chip relatief veel tijd kost. De Technische Universiteiten van Delft en Eindhoven onderzochten twee verschillende interconnectietechnologieën. Voor beide bestaat belangstelling.

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References ...

DSPE Opto-Mechatronics Symposium 2026

The seventh edition of the DSPE Opto-Mechatronics Symposium will take place on 8 October 2026

Intellectual property for engineers

Engineers working in high-tech solve complex technical problems every day. New algorithms, control strategies, hardware architectures, production methods and software tools are constantly being developed inside engineering teams.

Analysing the shock resistance of medical devices

Medical devices are often mounted on mobile trolleys and must survive shocks during transport, handling and everyday use, such as the sudden impact when a wheel hits a doorstep – a shocking encounter.