NEWS 2 February 2021

Wafer-handler systems engineering and magnetic bearing design

A systems engineering approach to the design of a wafer handler is presented in this Mikroniek article, starting with an introduction to wafer handling, followed by the corresponding requirements and...


A systems engineering approach to the design of a wafer handler is presented in this Mikroniek article, starting with an introduction to wafer handling, followed by the corresponding requirements and lastly common system architectures. Regarding wafer-handling robots, the conclusion is that the moving robot mass increases when contamination requirements become more stringent. Moreover, robotic concepts containing a linear stroke can improve stiffness and reduce mass at the cost of contamination-sealing complexity. To conclude, the design and realisation of a low-end, low-cost magnetic bearing for high-cleanliness robotic applications is discussed.


References ...

Going for ECP2 Gold: A journey of technical growth and lifelong learning

In June, Moiz Hyderabadwala, Senior Researcher at ASML Research, received the ECP2 Silver certificate, awarded through the European Certified Precision Engineering Course Programme (ECP2), a collaboration between Euspen and DSPE.

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Mastering thin metal production for mass-manufactured energy systems

The successful transition to a sustainable energy future hinges on the industrialisation of advanced energy-conversion technologies.

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Mikroniek June 2026: Design for Sustainability

The June issue of Mikroniek is devoted to Design for Sustainability. The main theme article presents the challenges of thin metal production for mass-manufactured energy systems.

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