Strategic opportunities for the Netherlands in 3D heterogeneous integration
Heterogeneous 3D integration is currently becoming a viable option to reach the upcoming compute demands.
This is facilitated, a.o., by advanced packaging technologies. VDL ETG is actively exploring this market. In this Mikroniek article we share our insight in the opportunities this brings for the precision ecosystem in the Netherlands. First, the concept of heterogeneous 3D integration is explained, followed by the requirements for different varieties of integration. The article then highlights the specific opportunities foreseen in this upcoming market and closes with a summary of current collaboration opportunities that are supported by funding. (Image courtesy of VDL ETG)
