NEWS 13 August 2020

Mikroniek June issue: Precision Mechatronics

The June issue of Mikroniek, click here for a first impression, features the theme of Precision Mechatronics. In part dedicated to the fourth DSPE Conference on Precision Mechatronics, it comprises...

DSPE

The June issue of Mikroniek, click here for a first impression, features the theme of Precision Mechatronics. In part dedicated to the fourth DSPE Conference on Precision Mechatronics, it comprises the conference programme, the abstracts of all papers and an overview of the posters and demos. Design stories in this issue feature a high-speed RFID die bonder for low-cost label production and a clean z-mechanism for a wafer handler robot wrist assembly. Other contributions include nanophotonics enabling a spectrometer on a chip and the euspen Conference report.

 

Please send an e-mail for information on how to obtain a hardcopy of the June edition.

 

 


References

Wafer-handler systems engineering and magnetic…

A systems engineering approach to the design of a wafer handler is presented in this Mikroniek article, starting with an introduction to wafer handling, followed by the corresponding requirements and...

Read more
Lunch Lecture March hosted by…

Development of the SPEXone spectropolarimeter instrument, the Dutch contribution to the NASA PACE satellite observatory By Alexander Eigenraam, senior mechanical design engineer at SRON Netherlands Institute for Space Research SPEXone...

Read more
The Dutch marriage between astronomy…

The Netherlands plays a prominent and long-standing role in astronomy. This is due in part to the Dutch expertise in systems engineering, precision optomechanics, mechatronics and control engineering. Dutch high-tech...

Read more