NEWS 7 February 2022

Iterative learning control Lunch Lecture March 7

Iterative learning control enables a next breakthrough in die bonder throughput Nexperia ITEC constantly strives to improve throughput and lower the cost of ownership of its die-bonding solutions. An important...


Iterative learning control enables a next breakthrough in die bonder throughput

Nexperia ITEC constantly strives to improve throughput and lower the cost of ownership of its die-bonding solutions. An important milestone is to increase die bonder throughput from 72.000 to 100.000 units per hour by the end of this year. To achieve this, faster and tailored setpoints are required on core motion axes of the die bonder. In this lunch lecture we show how iterative learning control is used to adapt feedforward parameters in runtime, maintaining a short settling time with these aggressive setpoints.

The speakers will be: Jasper Wesselingh, Gijs van der Veen

We will start at 12:02pm on March 7 2022

Please send an email to info@dspe.nl if you are interested in this Lunch lecture.


References

Picometer drift and microrad reproducibility

At the end of May, Settels Savenije hosted a DSPE Knowledge Day dedicated to challenges in nanometrology.

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Order of frictions and stiffnesses…

For lumped systems consisting of different frictions and stiffnesses, there has been confusion in literature about hysteresis curves and virtual play for many decades.

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Make it clean

In mid-April, the second edition of the Manufacturing Technology Conference and the fifth edition of the Clean Event were held together, for the first time, at the Koningshof in Veldhoven (NL).

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