NEWS 16 February 2021

Agile systems engineering approach towards high-throughput 3D metrology equipment for semiconductor process control

In the semiconductor industry, Moore’s law comes with increasing and complex demands and the need for advanced process control metrology. Nearfield Instruments fulfils these needs with their high-throughput scanning probe...


In the semiconductor industry, Moore’s law comes with increasing and complex demands and the need for advanced process control metrology. Nearfield Instruments fulfils these needs with their high-throughput scanning probe metrology (HT-SPM) systems. January 2018, they started working on their first product, QUADRA. By rigorously adhering to an agile systems engineering methodology and promoting the concept of a minimum viable product, as described in this Mikroniek article, Nearfield Instruments was able to develop, integrate, test, and subsequently ship their first QUADRA to a major semiconductor fab in December 2020.


References

Our DSPE chairman Hans Krikhaar…

𝗪𝗲 𝗮𝗿𝗲 𝗽𝗿𝗼𝘂𝗱 𝘁𝗼 𝗮𝗻𝗻𝗼𝘂𝗻𝗰𝗲 𝘁𝗵𝗮𝘁 𝗗𝗦𝗣𝗘 𝗣𝗿𝗲𝘀𝗶𝗱𝗲𝗻𝘁 𝗛𝗮𝗻𝘀 𝗞𝗿𝗶𝗸𝗵𝗮𝗮𝗿 𝗵𝗮𝘀 𝗿𝗲𝗰𝗲𝗶𝘃𝗲𝗱 𝗮 𝗚𝗲𝗿𝗮𝗿𝗱 & 𝗔𝗻𝘁𝗼𝗻 𝗛𝗶𝗴𝗵 𝗧𝗲𝗰𝗵 𝗦𝘁𝗮𝗿 𝗔𝘄𝗮𝗿𝗱 𝟮𝟬𝟮𝟲!

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Lunch lecture February hosted by…

Title: Piezoelectric wafer stage – for electron beam inspection systems

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Sensitivity analysis in Opto-Mechanical System…

As a mechatronics engineer at VDL ETG Technology & Development in Almelo (NL), Leon Nijenhuis got involved with opto-mechanics when working on aerospace projects. One of his duties was the design of an alignment tool for laser satellite communication.

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