NEWS 16 February 2021

Agile systems engineering approach towards high-throughput 3D metrology equipment for semiconductor process control

In the semiconductor industry, Moore’s law comes with increasing and complex demands and the need for advanced process control metrology. Nearfield Instruments fulfils these needs with their high-throughput scanning probe...

Julie van Stiphout - Sassen

In the semiconductor industry, Moore’s law comes with increasing and complex demands and the need for advanced process control metrology. Nearfield Instruments fulfils these needs with their high-throughput scanning probe metrology (HT-SPM) systems. January 2018, they started working on their first product, QUADRA. By rigorously adhering to an agile systems engineering methodology and promoting the concept of a minimum viable product, as described in this Mikroniek article, Nearfield Instruments was able to develop, integrate, test, and subsequently ship their first QUADRA to a major semiconductor fab in December 2020.


References

KNOWLEDGE DAY Engineering for Contamination…

A new edition of the DSPE Knowledge Day on Engineering for (Particle) Contamination Control will be held 2 April 2020.. The event will focus on design aspects aimed at dealing...

Read more
Lunch Lecture September 6 hosted…

Direct drive or Indirect? That’s the question. The lecture will be given by Niels Koenraad, Nobleo Technology Typical struggles in actuator selection are to balance upsides, such as high force,...

Read more
Knowledge Day Topology Optimization digital:…

In complex engineering problems, particularly with multiphysics, the multitude of boundary conditions quickly becomes too much for a single engineer to oversee. At the same time, the maturing of Additive...

Read more