NEWS 16 February 2021

Agile systems engineering approach towards high-throughput 3D metrology equipment for semiconductor process control

In the semiconductor industry, Moore’s law comes with increasing and complex demands and the need for advanced process control metrology. Nearfield Instruments fulfils these needs with their high-throughput scanning probe...


In the semiconductor industry, Moore’s law comes with increasing and complex demands and the need for advanced process control metrology. Nearfield Instruments fulfils these needs with their high-throughput scanning probe metrology (HT-SPM) systems. January 2018, they started working on their first product, QUADRA. By rigorously adhering to an agile systems engineering methodology and promoting the concept of a minimum viable product, as described in this Mikroniek article, Nearfield Instruments was able to develop, integrate, test, and subsequently ship their first QUADRA to a major semiconductor fab in December 2020.


References

QUADRA: metrology for the ongoing…

The semiconductor roadmap is currently fuelled by innovations along three trends

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Damping position-dependent parasitic vibrations

Parasitic resonances are often limiting the performance of precision machinery.

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Reducing noise and vibrations

Acoustics play a critical role in product development across various engineering domains, significantly impacting both functionality and user experience.

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