NEWS 16 February 2021

Agile systems engineering approach towards high-throughput 3D metrology equipment for semiconductor process control

In the semiconductor industry, Moore’s law comes with increasing and complex demands and the need for advanced process control metrology. Nearfield Instruments fulfils these needs with their high-throughput scanning probe...


In the semiconductor industry, Moore’s law comes with increasing and complex demands and the need for advanced process control metrology. Nearfield Instruments fulfils these needs with their high-throughput scanning probe metrology (HT-SPM) systems. January 2018, they started working on their first product, QUADRA. By rigorously adhering to an agile systems engineering methodology and promoting the concept of a minimum viable product, as described in this Mikroniek article, Nearfield Instruments was able to develop, integrate, test, and subsequently ship their first QUADRA to a major semiconductor fab in December 2020.


References

May 30 DSPE Knowledge day…

Please be invited to the upcoming DSPE Knowledge Day at Settels Savenije Eindhoven.

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Lunch lecture May hosted by…

Precision in roll -2- roll electronics

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YPN visited Kulicke & Soffa…

The Young Precision Network (YPN) - part of the DSPE community - organises events for young professionals and students. On Thursday February 1st, YPN organised a visit to Kulicke & Soffa in Eindhoven.

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