NEWS 16 February 2021

Agile systems engineering approach towards high-throughput 3D metrology equipment for semiconductor process control

In the semiconductor industry, Moore’s law comes with increasing and complex demands and the need for advanced process control metrology. Nearfield Instruments fulfils these needs with their high-throughput scanning probe...


In the semiconductor industry, Moore’s law comes with increasing and complex demands and the need for advanced process control metrology. Nearfield Instruments fulfils these needs with their high-throughput scanning probe metrology (HT-SPM) systems. January 2018, they started working on their first product, QUADRA. By rigorously adhering to an agile systems engineering methodology and promoting the concept of a minimum viable product, as described in this Mikroniek article, Nearfield Instruments was able to develop, integrate, test, and subsequently ship their first QUADRA to a major semiconductor fab in December 2020.


References

Order of frictions and stiffnesses…

For lumped systems consisting of different frictions and stiffnesses, there has been confusion in literature about hysteresis curves and virtual play for many decades.

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Make it clean

In mid-April, the second edition of the Manufacturing Technology Conference and the fifth edition of the Clean Event were held together, for the first time, at the Koningshof in Veldhoven (NL).

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Bringing particles to light

Particle contamination monitoring and cleanliness control are fundamental to micromanufacturing processes across diverse industries to achieve cost-effective production of high-quality and reliable microscale devices and components.

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