Iterative learning control enables a next breakthrough in die bonder throughput

Nexperia ITEC constantly strives to improve throughput and lower the cost of ownership of its die-bonding solutions. An important milestone is to increase die bonder throughput from 72.000 to 100.000 units per hour by the end of this year. To achieve this, faster and tailored setpoints are required on core motion axes of the die bonder. In this lunch lecture we show how iterative learning control is used to adapt feedforward parameters in runtime, maintaining a short settling time with these aggressive setpoints.

The speakers will be: Jasper Wesselingh, Gijs van der Veen

We will start at 12:02pm on March 7 2022

Please send an email to info@dspe.nl if you are interested in this Lunch lecture.