EVENT 7 February 2022

Lunch Lecture March 7 hosted by Nexperia ITEC

Iterative learning control enables a next breakthrough in die bonder throughput Nexperia ITEC constantly strives to improve throughput and lower the cost of ownership of its die-bonding solutions. An important...


About this event

Iterative learning control enables a next breakthrough in die bonder throughput

Nexperia ITEC constantly strives to improve throughput and lower the cost of ownership of its die-bonding solutions. An important milestone is to increase die bonder throughput from 72.000 to 100.000 units per hour by the end of this year. To achieve this, faster and tailored setpoints are required on core motion axes of the die bonder. In this lunch lecture we show how iterative learning control is used to adapt feedforward parameters in runtime, maintaining a short settling time with these aggressive setpoints.

The speakers will be: Jasper Wesselingh, Gijs van der Veen

We will start at 12:02pm on March 7 2022

Please send an email to info@dspe.nl if you are interested in this Lunch lecture.


7 March 2022


The Netherlands

Digital


References

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References

This is Techcafé about Digital…

A digital Twin is a virtual representation of the real world, including physical objects, processes, relationships and behavior. A digital twin is always an abstractationor a model of reality. Maarten...

Read more
Lunch Lecture September hosted by…

Position-Dependent Snap Feedforward: A Gaussian Process Framework

Read more
CryoEM zero-vibration cold tip

In life-sciences research, cooling biological samples of, for example, proteins, viruses and bacteria to extremely low temperatures facilitates new forms of microscopy.

Read more