EVENT 11 August 2020

From macro to micro


About this event


29 March 2018



References

Knowledge Day Topology Optimization digital:…

In complex engineering problems, particularly with multiphysics, the multitude of boundary conditions quickly becomes too much for a single engineer to oversee. At the same time, the maturing of Additive...

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Large dynamic range atomic force…

In semiconductor manufacturing, the shrink following Moore’s law requires ever tighter overlay and registration between the different (material) layers. For accurately characterising this overlay and registration, TNO has developed a...

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KNOWLEDGE DAY Engineering for Contamination…

A new edition of the DSPE Knowledge Day on Engineering for (Particle) Contamination Control will be held 2 April 2020.. The event will focus on design aspects aimed at dealing...

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References

Agile systems engineering approach towards…

In the semiconductor industry, Moore’s law comes with increasing and complex demands and the need for advanced process control metrology. Nearfield Instruments fulfils these needs with their high-throughput scanning probe...

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Mikroniek: Wafer-handler systems engineering and…

A systems engineering approach to the design of a wafer handler is presented in this Mikroniek article, starting with an introduction to wafer handling, followed by the corresponding requirements and...

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Wim van der Hoek Award…

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