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Knowledge
Thermomechanics
Introduction
Chapter 1: Basics
1.1 Temperature, heat and heat capacity
1.2 Heat transfer
Conduction
Convection
Radiation
Thermal contact conduction
Overview of thermal couplings
1.3 Principles of thermal deformation
1.4 Thermo-mechanical beam equations
Problem 1: Fixed-free beam
Problem 2: Fixed-guided-in-Y beam
Problem 3: Fixed-fixed beam
Problem 4: Fixed-guided-in-X beam
Problem 5: Fixed-simple supported beam
Problem 6: Simple supported-guided-in-X beam
Problem 7: Simple supported beam
Chapter 2: In depth
2.2 Conduction in Gasses
2.4 Thermal radiation
2.4.1 Basics
2.4.2 Radiative exchange
2.4.3 Gebhart method
2.4.3.1 Near black surfaces
2.4.3.2 Two surfaces facing each other
2.4.3.3 Numerical example
2.4.4 Net-radiation method
2.4.4.1 Numerical example
2.4.5 References
Chapter 3: Thermomechanical design
3.1 Material selection
3.2 Geometry
3.3 Design principles
3.4 Passive thermal conditioning
3.5 Active thermal conditioning
3.6 Compensation
3.7 Summary
3.8 References
Chapter 4: Thermo-mechanical modeling
4.1 Important variables
4.2 Lumped capacitance modeling
4.3 Advanced hand calculations
Chapter 5: Measurement
5.1 Contactless temperature sensors
5.2 Contact sensors
5.2.1 Thermocouples
5.2.2 Resistance thermometers PTC
5.2.3 Resistance thermometers PRT
5.2.4 PTC thermistor (alias posistor)
5.2.5 Resistance thermometers NTC
5.2.6 Semiconductor temperature sensors
5.2.7 Other types of contact sensors
Chapter 6: Calculators
Lump Mass model – steady state
Lump Mass model – transient
Radiation
Gas conduction
Thermal deformation
About
Design Principles for PM
JPE Precision Point
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Mastering high-density optical disks: a new concept design
Mastering high-density optical disks: a new concept design
Electronics
Medical technology
Precision-technology
Assembly Automation
by J.W.Sponck, M.H. El-Husseini, L.Jabben, P.M.Overschie, D,G.EHobbelen, P.du Pau, H.Polinder, J.van Eijk
18 July 2007
Download Assembly Automation
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