Optomechatronics Symposium 2023

It will be the fifth edition of the DSPE initiative that started in 2013 as the DSPE Optics and Optomechatronics Symposium in Eindhoven (NL).

Earlier editions were held in Delft (NL) in 2015, Aachen (Germany) in 2017, and Eindhoven in 2019. This symposium will be organized by DSPE. It is a great moment to network and meet technical peers. Partners of the symposium are the German photonics cluster Optence and Mikrocentrum.

Please send an email to info@dspe.nl if you would like to join this symposium.

Target group:

Engineers and architects strongly related to design and building of optical hardware.


Innovation, latest developments in optomechatronics shall be of practical use for engineers and designers. Design process from physics to practical solution/product.


Investment €195,00 excl VAT. Members of DSPE, Mikrocentrum and Optence €175,00 excl VAT, PHD €75 excl VAT.


Mikrocentrum, De Run 1115, Veldhoven.

Organisations are invited to exhibit.

Exhibition stand during symposium, space 8m2, electricity and standing table. We show your company logo on this website with an URL link.

Investment: € 450.00 excl VAT. 

€50 Reduction if you are member of Optence, Mikrocentrum or DSPE.

Standcrew need to register. Costs are €195 or €175 per person.

Exhibit information: Location Mikrocentrum, De Run 1115, Veldhoven

Contactpersoon: Julie van Stiphout, T +31(0)654308703, M info@dspe.nl

Program 30 March 2023

Chairman: Frank Schuurmans, Vice President Research ASML

09:10 – 9:30Welcome by the Chairman,
Frank Schuurmans Vice president Research ASML
09:30 – 10:00Stefan Obermaier
Product Systems Engineering Modules (SMT-XEEM)
ZEISS Sparte Semiconductor Manyfacturing Technology
Importance of Optomechtronics for EUV lithography now and in future
10:00 – 10:30Dr. Ir. Stefan Kuiper,
Mechatronic System Architect TNO
Deformable Mirror Development at TNO
10:30 – 11:00 Prof. dr. Wim Coene,
Parttime Professor at Faculty TNW
(Technische Natuurwetenschappen) of Delft University of Technology and Director of Research at ASM
Imaging of nanostructures without lenses
11:00 – 11:30Break / visit to the exhibition
11:30 – 12:00Andrew Boyd,
Optical Design Capabillity, lead Exalitas Technologies at Cioptiq St Asaph
Challenges and Opportunities in Gradient-Index Optics
12:00 – 12:30Christian Buß,
Head of R&D Alignment Turning Systems TRIOPTICS GmbH 
Alignment turning for high precision optomechanical systems.
12:30 – 14:00Lunch / visit to the exhibition
14:00 -14:30Andreas Biermanns-Föth
Head of Business Section Photon Instrumentation EUV/XUV Systems
Metrology tools and solutions for actinic EUV pellicle qualification.
14:30 -15:00 Ir. Sander Hermanussen,
Doctoral Candidate Control Systems Technology
group Faculty of Mechanical Engineering Eindhoven University of Technology
Adaptive wafer table for enhanced image plane conformity to both aerial image and wafer load geometry
15:00 – 15:30Cor Ottens,
System Architect at ASML
Opto-Mechanical applications in the machines of ASML
15:30 – 16;00Break / visit to the exhibition
16:00 – 16;30Michiel van Beek,
Sr. group lead Physics & Optics Sioux Technologies
System design of optomechatronic medical devices
16:30 – 17:00Tobias Müller,
Technical Director and Co-founder AIXEMTEC Gmbh
Automated Fiber (Array) to PIC attachment
17:00 – 17:10Conclusion of the day by chairman Frank Schuurmans
17:10Drinks / snacks visit to exhibition
18:00End of the program / Dinner time

Program Committee:

Stefan Bäumer – Principal Scientist & Sr. Optical System Designer TNO

Paul Urbach – Scientific Director Dutch Optics Centre / Professor Optics TU Delft

Hans Vermeulen – Sr. Principal Architect EUV Optics System ASML / Part-time Professor TU/e

Cor Ottens – System Architect Opto-Mechanics, Precision Mechanics ASML / president Special Interest Group Optics DSPE / Boardmember DSPE

Pieter Kappelhof – Technology Manager Hittech Group / Vice-President DSPE / Hybrid Teacher Opto-mechatronics TU Eindhoven

Invited speakers:

Stefan Obermaier, Key Functional Systems Engineer in ZEISS High-NA Mirror Metrology

Importance of Optomechtronics for EUV lithography now and in future

In recent years EUV lithography has been established in mass production with more than 100 EUV scanners and serves as a pioneer for the latest generation of chips. The next logical step on the path to further shrinkage, described by Moore’s Law, is to increase the numerical aperture (NA) of the optics in use. In consequence ZEISS and ASML are developing a new generation of high-NA EUV tools to enable even smaller feature sizes than what we currently have. The increased NA inevitably leads to larger and more extreme aspheric mirrors in the optical path and thus to increased requirements for the necessary manufacturing steps. A central component in this process is the surface metrology. For this purpose, ZEISS and ASML jointly developed a completely new, interferometry-based measuring tool to meet the stringent requirements in accuracy, precision, throughput, and reliability. With this lecture, we provide insight into the challenges of high-NA surface metrology and highlight the central importance of optomechatronics to meet the demanding requirements. Consequently, this leads to more complex systems. We will therefore also explain how we keep system availability high despite this grown complexity and increased throughput requirements.

Dr. Ir. Stefan Kuiper, Mechatronic System Architect TNO

Deformable Mirror Development at TNO

TNO is developing Deformable Mirror (DM) technology, targeted for aberration correction in high-end Adaptive Optics systems in the field of astronomy, space telescopes, and laser communication. The heart of this deformable mirror technology is a unique actuator technology based on the hybrid-variable-reluctance-principle. The main advantages of this actuator technology are the inherent high reliability, linearity (>99%), and high efficiency in terms of force per volume and unit power. Based on this actuator technology TNO has built and tested a number of DM’s that have found use in several applications including ground-to-ground laser communication. Furthermore, a highly compact Fine Steering Mirror has been developed based on this actuator technology targeted for use in laser-communication systems onboard satellites.The next step on the development roadmap is the realization of large Adaptive Secondary Mirrors (ASM) containing up to several thousands of actuators and optically powered (concave/convex) mirror-shells of up to Ø1,4m. These ASM’s are targeted to improve the imaging performance of the world’s largest astronomical telescopes. In this talk Stefan Kuiper from TNO will explain different aspects of this DM technology including its actuator technology, show recent experimental results, and give an outlook on the future development plans regarding this DM technology. https://www.tno.nl/en/focus-areas/industry/roadmaps/space-scientific-instrumentation/ground-based-astronomy/

Prof. dr. Wim Coene, Parttime Professor at Faculty TNW (Technische Natuurwetenschappen) of Delft University of Technology and Director of Research at AS

Imaging of nanostructures without lenses

End of 2018, a NWO-TTW Perspective Program was started with 5 academic groups in the Netherlands, on Lensless Imaging of 3D Nanostructures with Soft X-Rays (LINX). Within this LINX Program, an EUV beamline has been designed and constructed at the Delft University of Technology, for which the algorithmic concept of lensless imaging, also known as ptychography, has been developed in order to image nanostructures in future generation of chips from a number of far-field diffraction patterns. The table-top EUV beamline is 5m long, and is built around a high-harmonic generation (HHG) source where the harmonics in the EUV-range (10-20nm) are generated through interaction of a 100 W high power IR laser with a noble gas. The EUV beam further propagates to the imaging chamber, where the coherent quasi-monochromatic EUV light is focused on the sample by an ellipsoidal mirror. The EUV light is scattered by the nanostructures at the surface of the sample, and is reflected towards a camera, where a far-field diffraction pattern is recorded. A data-set comprising a multitude of these diffraction patterns is generated for multiple partially overlapping positions of the focused coherent probe on the sample which is mounted on a well-controlled sample stage. Such a data-set provides the necessary redundancy to transfer the acquired diffraction patterns into a computer-generated image of the sample by means of very specific algorithms. In the presentation, the multiple challenges will be further highlighted that have been and are being addressed to improve the imaging resolution of the EUV beamline.

Christian Buß, Head of R&D Alignment Turning Systems TRIOPTICS GmbH 

Alignment turning for high precision optomechanical systems.

Alignment turning has proven to be a very versatile technology for the efficient and accurate assembly of optomechanical systems. From small lenses in mass-produced microscope objectives to large lenses for semiconductor equipment, the use cases are very widespread. Today, the main technical challenges for alignment turning of highest precision objective lenses are imposed by aspheric lenses, large diameter lenses, and single micron tolerances. They often require additional pre- and post-processes to make efficient use of the alignment turning technology in the mid- to large-scale production. The smart measurement techniques and turning technology integrated in the Alignment Turning Machine from TRIOPTICS provide a solution to achieve this increase in efficiency. The lecture will establish an understanding of the benefits and limitations of the alignment turning process and will compare the traditional chuck-based method of alignment turning with more modern cnc-based methods of alignment turning. The lecture discusses specific results and gives suggestions for individual applications.

Andreas Biermanns-Föth, Head of Business Section Photon Instrumentation, EUV/XUV Systems RI Research Instruments GmbH

Metrology tools and solutions for actinic EUV pellicle qualification.

EUV lithography is used for chip volume production. EUV pellicles and dynamic gas lock windows in the scanner are corner stones for the technology. The pellicle is a thin film (≈ 50 nm thick) placed above the patterned surface of the EUV reticle and retains particles that would have otherwise landed on the patterned side of a reticle. As these particles are then out of focus, their impact on the imaged pattern is strongly reduced from the nanometer range to the micron range. Those thin film components must be qualified in various aspects before being used in production. In particular, the EUV transmission and reflectance at 13.5 nm in the bandwidth used in the scanner have to be quantified over the entire pellicle area such that best quality/ homogeneity for achieving desired CD is verified. RI Research Instruments GmbH (RI) supports the EUVL infrastructure with actinic metrology and test solutions and components. Based on RIs actinic EUV inband metrology concept (AIMER™), the EUV Pellicle Reflection and Transmission Tool (EUV-PRTT) has been co-developed with ASML and is used for pellicle production since 2020. In this presentation we will illustrate the main building blocks of the system and explain the working principle that allows to simultaneously measure EUV transmittance values above 90% and reflectance values as low as 0.002% with high spatial resolution and accuracy.

Ir. Sander Hermanussen, Doctoral Candidate Control Systems Technology group Faculty of Mechanical Engineering Eindhoven University of Technology

Adaptive wafer table for enhanced image plane conformity to both aerial image and wafer load geometry

In line with Moore’s law, the transistor count on integrated circuits doubles every two years, both by decreasing the feature size as well as stacking more functional layers. This results in more exacting requirements not only of the projecting optics of photolithography systems, but also of the wafer table which positions the silicon wafer for lithographic exposure. This talk presents an overview of the design of a deformable wafer table.  A set of multilayer piezo-electric actuators are mounted at the back of the adaptive wafer table. Both curvature as well as in-plane strain can be controlled by using different electrode patterns. To verify the functionality of the adaptive wafer table, a prototype actuator has been manufactured in collaboration with Penn State University. During exposure, a deformable wafer table can compensate for mismatch between the aerial image and wafer surface, similar to an adaptive mirror system. Moreover, dynamic excitations from the wafer positioning system can be damped. Additionally, the adaptive wafer table has the potential to mitigate friction during wafer load. In current systems, microscopic sliding between the wafer and wafer table causes irreproducible overlay errors and degrades the tribological properties of the wafer table. By deforming the wafer table conformally to each wafer before wafer load, overlay position can be predicted in advance, and wear is reduced.

Tobias Müller, CTO and Co-founder AIXEMTEC Gmbh

Automated Fiber (Array) to PIC attachment

The manufacturing of Photonic Integrated Circuits (PICs) requires the optical coupling of single mode fibers as single fiber or array for test or assembly purposes. The assembly and test task requires highest precision of fiber to waveguide alignment down to the deep submicron range – coupled with a broad component and product spectrum, this results in a high complexity for test and assembly machines in order to cover the broadest application spectra especially in research and development environments.

Cor Ottens, System Architect ASML.

Opto-Mechanical applications in the machines of ASML

More and smaller structures are needed in the chips to increase the calculation power and memory. The current possible  linewidth is in the nanometer range.

In the Lithography machines of ASML a pattern on a reticle or mask is exposed on a wafer. The number of layers on a wafer is going up to 300. The optical alignment of the layers or patterns with respect to each other is very important to create vertical contacts. For example, at linewidths of 20nm the alignment error must be around 2 nm. The accuracy of the measurement and positioning system must be within this 2 nm.

Stability of the mechanics determines the major part of the accuracy especially thermal drift is the biggest contributor.

To reach the tight stability specifications the correct mechanical constructions must be applied that keeps the optical elements in position even under extreme influences of temperature, vibrations, forces and stress. This presentation gives insight in the optomechanical construction principles that are used in the machines of ASML to make the high accuracies possible.

Andrew Boyd, Optical Design Capabillity lead

Challenges and Opportunities in Gradient-Index Optics

Since 2013, Andrew has undertaken substantial research into the optical design of gradient-index optical systems, and has developed a unique design capability at Qioptiq. Andrew’s design experience in GRIN includes work in layered polymer GRIN systems through to multispectral infrared GRIN systems and multi-material GRIN materials of arbitrary distribution. This work has been reflected in the successful design and manufacture of GRIN optics at Qioptiq and the generation of three technical publication in this field.  

Andrew is an experienced user of CodeV, Opticstudio and FRED optical design software; and the Python programming language. Andrew is currently working towards a PhD in the optical design of generalised GRIN systems at TU Delft. Work to date has focused on the generation of mathematical models for GRIN media consisting of an arbitrary number of materials, paraxial GRIN theory and optimisation, and freeform GRIN media that lack rotational symmetry.  

Andrew also serves as the Optical Design Capability Leader for the Excelitas St Asaph site, developing the technical capability of the optical design team in line with business need.

Michiel van Beek, Sr Group lead physics & optics Sioux Technologies

System design of optomechatronic medical devices

The field of pathology, including both structural as well as molecular analysis, is transforming from analogue into digital, requiring mechanization and automation of visual and manual functions previously performed by human operators. System design of medical devices needed for this transition not only requires optical and mechatronic design, but also advanced image processing as well as significant effort for quality assurance including tolerancing and calibration as well as regulatory aspects.  In this presentation I will focus on system design aspects that are relevant for the design and realization of a system for automated tissue dissection.


DSPE Partners:


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