EVENT 7 November 2021

Lunch Lecture December 6 hosted by Sioux Technologies

“Hope for the best but prepare for the worst” End-stop design challenges in Mechatronic Systems   DSPE Lunch Lecture December 2021 By Ronald Plak, Mechanical System Architect at Sioux Technologies...


About this event

“Hope for the best but prepare for the worst”
End-stop design challenges in Mechatronic Systems

 

DSPE Lunch Lecture December 2021
By Ronald Plak, Mechanical System Architect at Sioux Technologies

 

Do you dare to let your design crash on purpose? End-stops should never fail but how can you be sure?

By pushing our mechatronic designs to the limits also the end-stops often become critical and a limitation for the system performance.

The key to creating a robust end-stop solution is “keeping it simple”. But to create a simple design that works you do need to understand the complex crash behavior first.

In this presentation we will take you along some struggles from architecture choices, design optimizations, dynamic analysis, and testing. But most of all we will focus on some fascinating crash phenomena as hammering, re-bouncing and dynamic force amplifications so that they won’t surprise you when you need a crash device you can trust for your next critical application.

 

We will start at 12:02pm on December 6.

Please send an email to info@dspe.nl if you are interested in this Lunch lecture.


6 December 2021


The Netherlands

Digital


References

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References

This is Techcafé about Digital…

A digital Twin is a virtual representation of the real world, including physical objects, processes, relationships and behavior. A digital twin is always an abstractationor a model of reality. Maarten...

Read more
Lunch Lecture September hosted by…

Position-Dependent Snap Feedforward: A Gaussian Process Framework

Read more
CryoEM zero-vibration cold tip

In life-sciences research, cooling biological samples of, for example, proteins, viruses and bacteria to extremely low temperatures facilitates new forms of microscopy.

Read more