Mikroniek October: DSPE Conference report, Precision Fair 2016 preview, and Additive Manufacturing focus

Mikroniek October: DSPE Conference report, Precision Fair 2016 preview, and Additive Manufacturing focus

1 November 2016

The October issue of Mikroniek, click here for a first impression, which has recently appeared, is loaded with information. It contains a report of the DSPE Conference on Precision Mechatronics 2016 as well as a preview of the Precision Fair 2016. The theme of this issue is Additive Manufacturing, focussing on the industrial applications of 3D (metal) printing. A feature article is dedicated to the system architecture of the next generation die bonders of NXP ITEC; a redesign introduced a short stroke / long stroke wafer table with balance-mass functionality. 


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